ZXair-A IP portfolio

Name of the intellectual property portfolio: ZXair-A.

Sectors: chip manufacturing.
Technical areas: vertical signal transmission in stacked chips.

Title of the patent family Family
Receiver for near-field chip-to-chip multichannel transmission P50
Transmitter for near-field chip-to-chip multichannel transmission P52

This portfolio is no longer offered for sale, effective 2 october 2012. To obtain publicly available information on assignments, please click in the "Patent or PCT publ. No." column.

This portfolio comprises the items listed in the following table. To obtain the latest relevant document, click in the "Item ID" column.

Item ID Jurisdiction Application No. Filing date Patent or PCT publ. No. Issue Date Family
P50-A France 10/02802 2 Jul 2010 FR 1002802 20 Jul 2012 P50
P50-B PCT PCT/IB2011/052253 24 May 2011 WO 2012/001545 N/A
P52-A France 11/01902 21 Jun 2011 Pending Pending P52
P52-B PCT PCT/IB2012/052709 30 May 2012 WO 2012/176081 N/A


     Three-dimensional (3-D) integration enables an effective integration of complex systems. In a package using 3-D integration, chips may be stacked and structurally combined. In such a system-in-package (SiP), the vertical distance for signal transmission between two chips is typically smaller than 200 μm. Many vertical chip-to-chip transmission techniques have been developed. Techniques using through-silicon vias (TSVs) require an increased process complexity, whereas near-field chip-to-chip transmission does not involve specific manufacturing steps.

     The ZXair-A portfolio relates to a receiver and a transmitter for a near-field chip-to-chip multichannel transmission system such as the capacitive or inductive links used for vertical signal transmission between the stacked chips of a SiP using 3-D integration. These inventions can be used to reduce crosstalk between the transmission channels, over a wide bandwidth. Thus, it becomes possible to increase the number of transmission channels which may be created in a given area and/or to increase the transmission distance.

     For a conference with technical experts, please contact us.

Back to the home page

Back to Selling inventions

Web site: tekcem.com
URL: http://www.tekcem.com/tekclot5.htm © Tekcem 2012, 2013
Last update: 13 December 2013 reply to: webmaster@tekcem.com